Research on organic, printed and flexible electronics, smart textiles, smart garments and environmental sensors for IoT applications. The core objectives cover printing and additive deposition of electronic structures using novel functional nanomaterials (metallic nanoparticles, organic conductive compounds, carbon nanotubes, graphene) and integration of electronic functionalities on flexible foils and in textiles. Particular attention is devoted to R&D on sensors for detection of humidity, temperature and various chemical gases and vapours based on electrochemical and chemoresistive principle.
- Printed and large area electronic components (interconnections, passives, antennas, OECT transistors) realized by screen printing and Aerosol Jet Printing.
- Chemoresistive and electrochemical environmental sensors, carbon nanotubes (CNT) based gas sensors, RH and T printed sensors.
- Sensor systems for monitoring and distributed control of technological processes.
- Smart textiles with the focus on smart protective suits, gloves, bed sheets, textile based humidity, temperature and strain sensors and antennas for IoT.
- Novel contacting technologies for systems-on-foil and direct integration of electronic functionalities in textiles.
- Flexible electronic systems based on hybrid integration of printed and conventional components on foils and textiles.
- Textile based sensors, interconnections and antennas realized by hybrid combination of screen-printing, knitting and embroidering.
- Novel thick-film technologies using special metallic pastes for power applications (LED modules, concentrated photovoltaics, power modules).
- Direct writing of functional materials on 3D surfaces realized by Aerosol Jet Printing.
- Manufacturers of innovative textile products (smart protective garments and smart healthcare textiles).
- Manufacturers using thick-film technologies for power electronic applications.
- Manufacturers of sensors, electronic components and systems for IoT.
- Manufacturers of customized electronic solutions utilizing novel form factors (large-area, thin, flexible, 3D shaped, mouldable electronics, structural electronics).
- Manufacturers of printed, flexible and large-area electronic components and systems for e.g. smart packaging, smart labels and IoT applications.
- Manufactures needing precise control system using in-situ sensors for resin hardening processes (optimally cured composite products).